Hands-on implementations spanning the full VLSI design stack — from RTL coding and logic synthesis to physical design, timing closure, and fabrication-ready GDSII generation.
Complete RTL-to-GDSII physical design flow on PicoRV32a RISC-V processor — synthesis, floorplan, placement, CTS, routing, and STA using OpenLANE on Sky130 PDK.
Designed and integrated custom standard cell sky130_vsdinv; timing closure achieved via ECO flow; DRC/LVS clean; fabrication-ready GDSII generated.
Designed a 5-stage pipelined RISC-V RV32I core from scratch in TL-Verilog — fetch, decode, execute, memory, and writeback stages built progressively.
Data hazard bypassing logic, branch control, instruction and data memory integration; fully verified on Makerchip IDE with waveform simulation.
Built VSDSYNTH — a fully automated, design-agnostic RTL-to-QoR framework. CSV-driven configuration, automated SDC constraint generation, Yosys synthesis, and OpenTimer STA execution — all from a single command.
Validated on openMSP430 — 6845 gates synthesised, hierarchy check passed; professional QoR dashboard and CSV report auto-generated.
RTL-to-GDSII physical design of SPI controller using open-source Qflow EDA toolchain on OSU 0.18µm standard cell library — synthesis, placement, STA, and routing.
DRC/LVS clean using Magic and Netgen; 3,106 cells placed, 22,417 routes completed; fabrication-ready GDSII generated.
UART (parameterized, FSM-based, parity-checked) · Synchronous FIFO (configurable width/depth) · Traffic Light Controller (sensor-driven FSM with priority logic) · Automatic Temperature Controller · Washing Machine Controller.
Structured testbenches developed for all 5 modules; functional simulation and waveform verification performed using ModelSim.
Thermal simulation of flip-chip BGA packages in ANSYS Electronics Desktop; thermo-mechanical reliability analysis in ANSYS Mechanical for stress and deformation study.
3D package cross-section modelling — die, substrate, wire bonds, and encapsulation; comparative study of wire bonding, flip-chip, and QFN packaging methodologies.